Modeling and Simulation of Electromigration Behavior for Via Array Structure

الأصل · EN

In this paper, we develop a analytical model and algorithm for calculating uneven current distribution in via array structures. We propose a stress time translation formula and cumulative failure distribution equation to model the memory effect of electro migration stress or damage on a via array structure. We develop a method to project via array electromigration (EM) lifetime based on an arbitrary via failure sequence, and demonstrate that the proposed via array EM lifetime distribution trend correlates well with experimental results.